We apply the latest in advanced manufacturing techniques combined with Lean Production, Six Sigma principles via Intelligent Manufacturing System (IMS) to bring your products to market—better, faster with reasonable cost. Recognized for operational excellence and quality for highly regulated markets, we help you realize your vision - one stop solution.
We provide our customers with total manufacturing solutions, take care of each stage of the manufacturing process, from printed circuit board assembly (PCBA: SMT/SMD, DIP/PTH/Thru-hole, programming, AOI/SPI/ICT/X-ray/ATE/FCT testing, conformal coating, burn in/aging ect.) to Box Build or final assembly. Including early supplier involvement, product design, quick turn prototype, pilot build, pre-production, mass production, after-sales service.
A) SMT COMPONENTS: 0201 and above
B) IC pitch: Minimum 0.2MM
C) PCB Size: 50*30MM-400*315MM
D) BGA/QFN: Available
E) SMT CAPACITY: 3.0 Million points per day
F) DIP CAPACITY: 0.30 Million points per day